J.A.M.E.S Coin NFC in AME

June 29, 2022
State: Concept Phase
  • by J.A.M.E.S Team
    J.A.M.E.S GmbH
  • Educational
  • DragonFly IV
  • Easy Entrance
  • mCAD
  • Soldering on DragonFly IV AMEs
  • Gluing on DragonFly IV AMEs
  • NFC
  • AME Coils
  • AME Capacitors
  • Embedding components
  • Stacking DF IV AMEs



The purpose of this design remains to be purely educational. It is meant to give a brief introduction on the full potential of the AME technology by embedding the COTS components of the J.A.M.E.S Coin NFC on AME – PrintC design, published by the J.A.M.E.S Team. The functionality, namely providing an electronic business card, remains the same. However, the stability of the solder- or glue-connections is highly increased due to the complete embedding and covering.

Future field of application:
Since the J.A.M.E.S Coin NFC in AME design already includes many of the advantages of the AME technology, like: printing customized capacitors, embedding components, realizing three-dimensional volumes etc.; it is very well suited to be used as a benchmark example to compare different AME processes and technologies.

Current technology limitations:

At the current level of the AME technology, the embedding process is a manual process. So, in order to completely cover the COTS components, an additional manual assembling process needs to be done. In future printer technologies and processes, it would be valuable to have an automatic process included which allows to embed and assemble the COTS components during the printing process.

Key Features

  • Embedding components in NNDM DF IV AMEs
  • Stacking of NNDM DF IV AMEs
  • Populating NNDM DragonFly IV AMEs


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