Visionary and international group of diverse industry leaders working together to bring the cutting-edge technology of AME to a mainstream global audience.
The goal of this design is to provide a first impression on how to map out electronic circuits in a 3D mCAD tool and how to integrate them inside an 3D body. To do so, an NFC tag functionality is added to the previously designed and non-functional J.A.M.E.S Coin Housing, published by the J.A.M.E.S Team. With this addition to the J.A.M.E.S Coin Housing, the new structure can already be used as an electronic business card.
Future field of application:
Since the electronic circuit is still simple, the J.A.M.E.S Coin NFC on AME – Freestyle is very well suited as an easy-to-understand test device for new technologies. It can even be thought as a simple benchmark example to compare different printer technologies to each other.
Current technology limitations:
After populating the J.A.M.E.S Coin NFC on AME – Freestyle, it turned out, that the conductive pads are not very stable. This means that if mechanical pressure is applied to the soldered or glued components, the pads will be teared off together with the components. Therefore, the J.A.M.E.S Coin NFC on AME – Freestyle functionality is lost. In order to increase the reliability of the soldered interconnects, it would be helpful to either increase the stability of the conductive pads, or alternatively provide a verified procedure to cover the solder interconnects. This second alternative allows to completely embed the soldered components, and thus to prevent them from being ripped off.
Design experiences:
During the design process, some issues appeared due to the missing schematic and wiring diagram in the background. A suitable combination of the eCAD schematic that provides detailed information about which pads need to be interconnected, would massively facilitate the design process in the three-dimensional mCAD tools.
Key Features
Designing electronic circuits by mCAD
Designing customized NFC coils for AME
Populating NNDM DragonFly IV AMEs
FundAMEntals
(8)
FundAMEntal_DragonFlyIV_Nano_Dimension
1.77 MB
Fundamentals_Container
0.79 MB
PCB_Design_Rules_for_DragonFly_IV
0.41 MB
FundAMEntal_Slicing3DBodies
4.89 MB
FundAMEntal_IR_Heater_Soldering_Datasheet
14.61 MB
FundAMEntal_IR_Heater_Soldering_HowTo
13.52 MB
FundAMEntal_Conductive_Gluing_Datasheet
12.88 MB
FundAMEntal_Conductive_Gluing_HowTo
25.47 MB
Want to get started on your own?
Check the tutorial videos below
Design AME NFC Coils
Sign Up for Downloads
Join the Community and get free access to valuable content about this design
Please check your email and follow the instructions to confirm your subscription!
You are currently unsubscribed and can not subscribe again because of Spam protection. Please contact J.A.M.E.S if you want to subscribe for newsletters again.