SIP – System in package

June 29, 2022
State: 0 designs
  • by J.A.M.E.S Team
    J.A.M.E.S GmbH
  • DragonFly IV
  • Heterogeneous Integration
  • SIP
  • Connecting chips
  • Embedding components
  • Hybrid AMEs
  • RF Amplifier


The Vision:
The goal of this story is to create a reliable and efficient way to design and manufacture system-in-package (SIP) devices. In contrast to traditional approaches, it is intended to avoid wire bonding processes. Instead, the connection of the bare die to the AME carrier structure will be realized with suitable AME printing processes. While the focus of this story is to derive a general methodology for creating SIP structures, the findings and ideas could be verified using RF Amplifiers.

List of requirements and targeted architecture

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