StackUp_LF Coupon

November 25, 2022
State: Verified Phase
  • by J.A.M.E.S Team
    J.A.M.E.S GmbH
  • Fundamental Design
  • DragonFly IV
  • mCAD
  • Stacking DF IV AMEs
  • Gluing on DragonFly IV AMEs
  • DC-AC electronics



The purpose of the StackUp LF design is to go beyond the official printing height by stacking one AME structure on top of the other. Of course, to make this work, it is essential to have a reliable procedure to also get the electronic signals from one of those structures to the next one. This design shows one possibility to realize this for signals in the DC and AC range. It was originally designed for the Nano Dimension DragonFly IV system and takes into account that the system does not provide support material. Nevertheless, the StackUp LF design offers a way to stack and connect an arbitrary number of different AMEs. This design represents a test structure to verify the basic stacking process without providing any additional functionality. In the download area you will find three parameterized designs. One design is the base plate on which the two stacking designs are placed. Furthermore, there are two separate pdf files attached that show the verified design parameters as well as a step-by-step procedure for the assembly process.

Future field of application:

While the StackUp LF design is meant to cover DC and AC signals, it lacks the possibility to also transfer RF systems from one printed structure to another. To also be able to cover the RF range some significant adjustments will have to be done, in order to achieve some acceptable reflection coefficients while going from one structure to the next one.

Current technology limitations:

The design was originally created for the Nano Dimension DragonFly IV system. In this printing system, there is no support material available and thus at least ne side of the structure need to be flat. The design needed to be adapted to this at the cost of requiring much more space than it would have needed with an available support material. 

Key Features

  • Stacking AMEs
  • Overcoming the print height limitation
  • DC/AC transmission

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