What are the major differences of DragonFly AME output and traditional manufactured electronics?
Manufacturing Multiple Layers
Although a traditional printed circuit board can have more than one layer, it’s not truly a 3D design space. By contrast, in AME devices, connections can be made in any 3D direction.
Embedded Passive Components
Many passive components, such as resistors, capacitors, inductors, can be printed inside the HiPED and operate at much the same level or better than off-the-shelf components.
Completely Freedom and Flexibility of Form
The additive fabrication technique frees electrical engineers from the planar form to imagine other layout possibilities. IC chips can be mounted in any surface.
No More Subtractive Processes
No subtraction means no etching, trimming, or drilling, so the process generates 90 percent less waste in material and water than traditional PCB factory production.
Reach out to the Nano Dimension Specialists to create world-changing technology