HYDRA - Hybrid approach of thick-film and laser direct structuring for functionalization of 3D-ceramics
Thick-film technology on 3D-substrates did not reach fineline resolutions like in standard screen-printing processes but offers excellent packaging characteristics. Laser direct metallization of ceramics offers very high line resolutions but only limited interconnection characteristics. Therefore, a combination of both technologies on the same substrate will be addressed to overcome the single disadvantages and generating 3D-AME ceramic substrates with fineline and high power conductive paths on the same surface.
The project is realized on industrial machines but needs a comprehensive expertise of different market participants. Therefore, are we currently looking for advisory committee partners from the field of AME production, engineering, electronic components or sensor manufacturing and material development or supplier. We kindly invite you to bring in your expertise to improve the development process and reaching next technology levels together.
M. Sc. Kai Werum
Apl. Prof. Dr. Frank Kern
Dr.-Ing. Paul Gierth
The combination of ceramic additive manufacturing and thick-film as well as direct-writing technologies opens up a wide range of new applications for harsh environments
Additive manufacturing has high innovation potential for ceramic products in terms of design and the ability to produce novel composite and gradient materials.
While additive processes offer new possibilities through their principle, the combination with established thick-film and direct-writing technologies further expands the spectrum of functions, components and applications.
A wide range of packaging technologies such as soldering, bonding, welding, wire bonding or sintered assembly are available for electrical contacting and the assembly of other electronic components.
The technology combinations presented pave the way for manufacturing applications in electronics and power electronics as well as sensor and energy technology.
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