Michael Larson
Lead R&D Engineer (Aerospace)
For a while, 3D printing in electronics was restricted to the circuit boards that house components. Now, though, 3D printing is ushering in ...
For a while, 3D printing in electronics was restricted to the circuit boards that house components. Now, though, 3D printing is ushering in an exciting new age and actually producing the components themselves.
Cutting-edge AME technologies are making it possible to produce semiconductors quickly and easily. These are components made up of materials with different properties and ratings – for instance, conductive and insulating materials, which modern multi-material printing can achieve.
As the demand for semiconductors continues to ramp up – the market is expected to grow by 15% in 2025 alone – organisations need to be able to prototype and deploy components without delay.
This is another area in which AME really comes into its own. 3D printing makes prototyping simple and straightforward while also reducing the wastage typically associated with product development.
If we are to keep up with semiconductor demand, we need game-changing technology – and AME is exactly that.