Advances In Miniaturization: How GED Is Making Electronics Smaller And More Powerful
Advancements in Miniaturization: How GED Makes Electronics Smaller and More Powerful Modern electronic products are required to meet the highest standards: smaller, more powerful, and energy-efficient—all without compromising quality. Especially ...
20.01.2025
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Hybrid Additive Manufacturing: The Best Of Both Worlds In Production
20.01.2025
Fachverband Elektronikdesign und -fertigung e. V.
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FED: Additive Processes Improve PCB-quality
27.11.2024
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Ultra-Thin Chips With Printed Interconnects On Flexible Foils
The research paper "Ultra-Thin Chips with Printed Interconnects on Flexible Foils" was authored by Sihang Ma, Yogeenth Kumaresan, Abhishek Singh Dahiya, and Ravinder Dahiya. Published in Advanced Electronic Materials in December 2021, this work showcases innovations in hybrid flexible electronics.
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