AME Designs
View detailed AME application designs and learn about innovative 3D printed electronics. This section highlights advanced design practices and provides insights into the creative processes behind successful AME projects.
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HENSOLDT
Fraunhofer IKTS
Technology
Ink-Jet
General AME
Pick and Place (P&P)
Metallization
Printer
DragonFly IV
Standard
IPC
MIL
RTCA
DO 160 airborne equipment
DIN EN ISO 2409 cross-cut for PCBs
Application Type
Printed Circuit Structures (PCS)
Sensors and Antennas
Embedded Electronics
Printed Circuit Board (PCB)
Waveguide
Airborne equipment
RF
Heterogeneous Integration
TestCoupon
Cyber hardware security
Coating
Tool
Flight Control
Qualification and Test
RTCA/DO-160F
RTCA/DO-160G
Dielectric Constant
Dissipation Factor
Long term stability
Warpage
Cross-cut Testing
Bond pulling test
Thermal stability
Routing strategy
Full 3D wiring
No VIAs
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