Emily Patterson

System-in-package (SIP) designs are really changing the landscape when it comes to electronic engineering. With SIP, engineers are able to group integrated chips together with components like capacitors and resistors.

The device becomes a fully integrated whole, saving space without compromising on performance.

But where does AME fit into this?

Perhaps the most valuable benefit of AME here is its low-temperature operation. Complex SIP devices can be created with minimal thermal stress, supporting complex builds without putting components at risk.

As well as this, the 3D nature of AME builds means designers are free to place components wherever they are needed. They are not restricted to placing components within specific layers, resulting in more design flexibility and agility.

SIP designs are going to shape the development of electrical engineering, and AME complements this perfectly, helping engineers do more with SIP technology.