XTPL Ag Nanopaste CL85
Jul 26, 2024
XTPL Ag Nanopaste CL85 is a high-performance material designed for printed electronics, featuring silver nanoparticles that ensure excellent electrical conductivity. It is compatible with various substrates, offering good adhesion and flexibility, making it suitable for advanced electronic applications.
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Benefits
- Dispenses through 1.5 μm nozzles for uniform thin lines
- Exceptional non-clogging properties allow more than one month, 2.5 μm nozzle lifetime
- Suitable for printing on vertical surfaces
Compatible with XTPL Printers.
Electrical Performance
Resistivity: \( 4.2\cdot10^{-8}\Omega\cdot m\nonumber \) @ \( 250^{\circ}C \text{ for 40 minutes}\nonumber \)
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