Ultra-Thin Chips With Printed Interconnects On Flexible Foils

The study has overcome challenges in the integration of fragile UTCs with flexible foils for hybrid flexible electronic systems by using non-contact printing. Standard methods of integration mostly damage the UTCs, while this new route employs non-contact printing to provide robust interconnects with high electrical conductivity and mechanical stability.

In this context, the core of the research is based on XTPL's high-precision extrusion printing technology, which enables reliable interconnects for ultra-thin chips on flexible substrates. The technology supports seamless integration using a conductive silver nano-paste (XTPL CL85) with resolutions as fine as 1 µm. This approach eliminates the mechanical stress and high-temperature requirements typical in traditional bonding methods, preserving chip integrity and performance.

1. Introduction: Challenges and opportunities in hybrid flexible electronics.
2. Chip Thinning: Techniques for reducing chip thickness to 35 µm.
3. Printing Interconnects: Details of XTPL's extrusion printing for robust bonding.
4. Device Characterization: Evaluating electrical and mechanical performance.
5. Conclusion: Key findings and future applications.

Precise and Reliable Interconnects: XTPL enabled the direct deposition of high-viscosity silver paste, yielding low-resistance, highly conductive interconnects.

Minimal Performance Degradation: Even after the addition of printed interconnects, the UTCs still exhibited a high field-effect mobility of 630 cm²/Vs with minimal degradation due to the added resistances.

Mechanical Stability: The bonded UTCs exhibited good performance under bending conditions with a 40 mm radius, which provessuitable for flexible electronics.

Simplified Fabrication: This single-step additive process removes theneed for complicated traditional methods, significantly decreasingmanufacturing cost and complexity.