XTPL Au Nanopaste 90
Jul 26, 2024
XTPL Au Nanopaste 90 is a gold nanopaste tailored for printed electronics, focusing on fine feature printing and electrode deposition in sensor applications. Its nanoparticle-based composition, with predominantly spherical nanoparticles, ensures enhanced metal loading, providing a substantial conductive component in a single pass. This ink's unmatched anti-clogging properties make it ideal for fine feature deposition. It is versatile enough to print on various substrates, including glass, PCB materials, and foils like PET and Kapton.
For further information or inquiries, please contact us. Our team is ready to assist you with your specific needs.
Benefits
- Line thickness: \( < 745.5nm \nonumber \)
- Excellent compatibility with various substrates
- Ideal for the deposition of fine features
Compatible with XTPL printers.
Electrical Performance
Resistivity: Â \( 8.13\cdot10^{-8}\Omega\cdot m\nonumber \) @ \( 350^{\circ}C \text{ for 20 min} \nonumber \)
Related Articles
J.A.M.E.S GmbH
5 Likes
5 Likes
Horizon Microtechnologies - Using The BMF MicroArch S240 System
23.09.2024
J.A.M.E.S GmbH
0 Likes
0 Likes
Explore The Impact Of AME On The Bare Die Packaging Industry Webinar Recap
02.02.2024
J.A.M.E.S GmbH
0 Likes
0 Likes
Rapid Estimation Method Of Dk & Df Parameters For AME Materials
08.12.2023
About Us
© 2025 J.A.M.E.S GmbH.