Profile
Interests
DragonFly IV
Micro Dispensing
Multijet
Inkjet
InMold Electronics
Piezo Jetting
3D Ceramic
Pick and Place (P&P)
Photopolymerization
Printed Circuit Structures (PCS)
Sensors and Antennas
Flexible Electronics
Printed Circuit Board (PCB)
Power Electronics
Packaging
Multi-Material 3D-printing
SiP System in Package
Moulded Interconnection Device (MID)
digital solder mask
CeraPrinter F-Serie
Industry
Machinery
Country
France🇫🇷
Member Since
Dec 15, 2024
About Us
© 2024 J.A.M.E.S GmbH.