Packaging
J.A.M.E.S GmbH
4 Likes
4 Likes
3D Printing Electronics For GaN Power Module Packaging At RI.SE
16.07.2024
J.A.M.E.S GmbH
1 Like
1 Like
Breaking Update: J.A.M.E.S And XTPL Redefining 3D Manufacturing
11.09.2023
Packaging Community
Andreas Salomon
J.A.M.E.S GmbH
- Chief Scientist
Frederic Güth
Fraunhofer Institute for Electronic Nano Systems (ENAS)
- Research Associate
Nicolas Bernardin
- Business Development Director
Aubrey Barago
Hochschule der Medien
- Student
Featured Partners
About Us
© 2025 J.A.M.E.S GmbH.