Packaging
J.A.M.E.S GmbH
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3D Printing Electronics For GaN Power Module Packaging At RI.SE
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J.A.M.E.S GmbH
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Breaking Update: J.A.M.E.S And XTPL Redefining 3D Manufacturing
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Packaging Community
Andreas Salomon
J.A.M.E.S GmbH
- Chief Scientist
Frederic Güth
Fraunhofer Institute for Electronic Nano Systems (ENAS)
- Research Associate
Nicolas Bernardin
- Business Development Director
Aubrey Barago
Hochschule der Medien
- Student
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