Packaging

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8 Likes
Additive Manufacturing Of Interposers With Curved Vias For Microelectronics Packaging
28.01.2025

J.A.M.E.S GmbH
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5 Likes
3D Printing Electronics For GaN Power Module Packaging At RI.SE
16.07.2024

J.A.M.E.S GmbH
1 Like
1 Like
Breaking Update: J.A.M.E.S And XTPL Redefining 3D Manufacturing
11.09.2023
Packaging Community
Andreas Salomon
J.A.M.E.S GmbH
- Chief Scientist
Frederic Güth
Fraunhofer ENAS
- Research Associate
Nicolas Bernardin
- Business Development Director
Aubrey Barago
Hochschule der Medien
- Student
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