AM Process For Low Impedance Electronics Webinar Recap
Thank you, everyone, who attended the webinar "AM Process for Low Impedance Electronics." We are glad to inform you that this was a huge success and managed to gather considerable interested attention. For those of you who might be interested in referring back to it, we have prepared a PDF compiling all insights and discussions. This document captures all of the key points and learning you must have gathered by now so you do not miss out on any important information. Feel free to download and read more about it.
Recap of the Webinar
"The journey from two-dimensional traditional Printed Circuit Boards (PCB) to advanced three-dimensional technology": This was how the insightful development of Additive Manufacturing (AM) of electronics was analyzed in the beginning. The session went on to take a deeper look at how AME could be transformational and showcase its unique capabilities across multiple applications. Current printing techniques were discussed in the next part of the webinar, showing its significant impact on high-frequency performance. Finally, the webinar also featured an aspect on the role of CFD simulations in optimizing electronic manufacturing outcomes that represented quite a leap forward.