Why Nano Dimension? We're Reinventing Manufacturing
A provider of intelligent machines for the fabrication of Additively Manufactured Electronics.
Design And Performance Of AM In-Circuit Board Planar Capacitors
Design and Performance of Additively Manufactured In-Circuit Board Planar Capacitors This publication by Sokol D., et al. showcases the design and efficacy of additive manufacturing-based planar capa
Compact Multilayer Bandpass Filter
Compact Multilayer Bandpass Filter Using Low-Temperature Additively Manufacturing Solution This publication was written by Li M., et al. in 2021, and present an additively manufactured bandpass filt
Additively Manufactured Millimeter-Wave
Additively Manufactured Millimeter-Wave Dual-Band Single-Polarization Shared Aperture Fresnel Zone Plate Metalens Antenna This publication was written by Zhu, J., et al. in 2021 and presents the deve
AME And Micro-AM Tech Day Event
Tech-Day: Tipping The Scales Of Innovation Through Micro-AM And Additively Manufactured Electronics On Tuesday, April 27th, Nano Dimension hosted a technology day event, where it was showcased the la
Nano Insights - AME and J.A.M.E.S
Build, Test, Iterate Electronics in a Single Day
Nano Dimension is the pioneer and sole provider of AME 3D printers. The company’s signature system for high-performance electronic devices (HiPED®) is DragonFly. Nano Dimension also provides the software to prepare AME designs for printing, called FLIGHT. FLIGHT contains aspects of both 2D electronic CAD (ECAD) and 3D mechanical CAD (MCAD).
How DragonFly works
DragonFly uses multi-material inkjet deposition to build electronic circuits layer by layer. Most projects employ AgCite™ ®– a breakthrough silver nanoparticle ink for conductive connectors and passive components as well as a dielectric polymer (acrylate) that provides insulation and structure. The metal and substrate are printed simultaneously -- the metal is cured by infrared light, and the polymer by UV. The precise balance of these two material processes in DragonFly creates structurally stable circuit boards, antennas, and complex geometric applications with electric performance comparable to devices with standard components.
What are the major differences of DragonFly AME output and traditional manufactured electronics?
Manufacturing Multiple Layers
Although a traditional printed circuit board can have more than one layer, it’s not truly a 3D design space. By contrast, in AME devices, connections can be made in any 3D direction.
Embedded Passive Components
Many passive components, such as resistors, capacitors, inductors, can be printed inside the HiPED and operate at much the same level or better than off-the-shelf components.
Completely Freedom and Flexibility of Form
The additive fabrication technique frees electrical engineers from the planar form to imagine other layout possibilities. IC chips can be mounted in any surface.
No More Subtratctive Processes
No subtraction means no etching, trimming, or drilling, so the process generates 90 percent less waste in material and water than traditional PCB factory production.