News & Media AME Webinars Explore The Impact Of AME On The Bare Die Packaging Industry Webinar Recap

Explore The Impact Of AME On The Bare Die Packaging Industry Webinar Recap

Feb 2, 2024

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Explore The Impact Of AME On The Bare Die Packaging Industry Webinar Recap

We extend our heartfelt gratitude to all attendees who joined us for an insightful webinar led by our esteemed expert, Nikita Rybalka. For those who couldn't attend or wish to revisit the valuable insights, the webinar recording is available.

Recap of the Webinar

Nikita began the webinar with an explanation of what bare die were and the basic functions behind them before moving on to the most important question: why should we use them? Among the most notable takeaways, it offers benefits of miniaturization, being cost-effective, and customization to make electronics smaller, more affordable, and tailored to exact needs.

He also gave the historical overview, tracing bare die packaging from the very beginning when it appeared in the 1960s. Participants grasped how this technology started and evolved over the decades, to set the stage for the pivotal role that it is playing today. Also highlighted during the webinar are some of the challenges in semiconductor packaging, complexities in miniaturization, and materials involved. For all those who missed this fabulous webinar or who are interested and want to revisit what Nikita said, kindly view the recording at your convenience.