News & Media AME Webinars NScrypt - NextFlex Strength Of 3D Printed Electronics Webinar

NScrypt - NextFlex Strength Of 3D Printed Electronics Webinar

Jun 8, 2024

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NScrypt - NextFlex Strength Of 3D Printed Electronics Webinar

nScrypt sponsored the second annual installment of this free webinar, which was co-sponsored by NextFlex.

A distinguished industry panel provided an in-depth discussion of the continued migration from PCBs to printed circuit structures (PCS), conformally integrating circuits into device structures.

PCSs solve the problem of incorporating an increasing number of active and passive electronic components and antennas into increasingly smaller and complex electronic packages.

The panel predicts PCSs will eventually replace PCBs as electronics are reshaped and reformed, and become part of the structure of electronic devices.

Strength of 3D Printed Electronics Webinar

05:54 Raytheon Technologies
- Highlights in Additive Manufacturing for Microwave Microelectronics Applications
  - Printed Electronics at Raytheon Technologies and the Raytheon-UMass Lowell Research Institute
08:34 The Printed Electronics Research Collaborative (PERC)
- Technology Focus
- Research Highlights: Dielectrion and Ferroelectric Inks
- Design, Fabrication, Characterization of Tunable Metamaterials
- Material Characerization
  - Conductors
  - Dielectrics
  - Interconnects
- Fully Printed Examples
  - Patch Antenna
  - C Band RF Channel
- Applications and Needs
and lot's of more contributing presentations
- Reimaging Healthcare with 3D Printed Electronics & Sensors (by Johnson & Johnson)
- End to End AM Solutions, Extension to 3D Printed Electronics (by Siemens Corporation Technology US)
- Materials Development And Additive Manufacturing for RF Devices (by DeLUX and University of Delaware)