Pan-European Electronics Design Conference - REGISTER NOW !
IPC and FED e.V. are calling for submissions from design engineers, researchers, academics, technical experts, and industry leaders for the inaugural Pan-European Electronics Design Conference (PEDC), scheduled for January 29-30, 2025, at the NH Danube City Hotel in Vienna, Austria.
This conference will feature peer-reviewed technical and scientific presentations highlighting the most recent advances in electronic design. Topics include:
- Silicon-to-Systems
- Design for Excellence
- Design Software and Tools
- Design Process and Product Life Cycle
Presenting at PEDC offers participants and their organizations an opportunity to gain visibility and forge connections within the European electrical engineering industry and scientific community.
The conference's language is English.
To register click here.
Table of Contents
Experts Showcase
At PEDC-Pan-European Electronics Design Conference, organised by IPC and FED, industry experts will showcase the innovations shaping the future of electronics.
"A Silicon-to-Systems Approach of an Open-Source Smartwatch Design."
on 29 January as Keynote
Lukas Henkel, OV Technologies, LLC, Germany
Discover how a wearable device, built around an in-house developed SIP-System-In-Package with embedded silicon-based inductors and ultra-high-density thin film substrates, sets new standards in miniaturisation. Designed with a Linux-based operating system and a focus on sustainability through high repairability, that smartwatch design is a benchmark for knowledge transfer and state-of-the-art electronics design.
"Novel Method to Prove Power Module Design Robustness Using Hyperparameter Tuning With SHERPA”
Wilfried Wessel, Solution Architect, Siemens EDA (Siemens Digital Industries Software), Germany
and PhD student, TU Dublin, Ireland,
will talk about
- how hyperparameter tuning supports automated optimisation of power modules by ensuring equal device temperatures
- improving reliability
- extention of power module lifetime
and valuable insights for professionals interested in
- power module design optimisation
- innovative approaches to enhance performance
- predict manufacturing yield
“Mitigation of Resonances in Metal Shielding Enclosures for Integrated Circuits”
on 29 January,10:30, 2025 as part of the
Silicon-to-Systems and Design Techniques: High Frequency session
María Cuesta Martín, Product Manager EMC Shielding & Thermal Materials, Würth Elektronik Group, Germany
Discover how integrating absorber materials into shielding enclosures can overcome resonance challenges.
Topics:
- Addressing cavity resonances that degrade shielding effectiveness and cause unwanted coupling
- Extending the usability of metal enclosures beyond 5GHz through innovative design strategies
- Characterising absorber materials to optimise their placement and performance for high-frequency applications
„AI-Driven Automation of ECAD Library Footprints“
on 30 January 2025
Savita Ganjigatti, VP Engineering, Sienna ECAD Technologies, India, will speak
The manual creation of electronic component footprints in ECAD libraries has long been a time-consuming and error-prone process.
This presentation introduces AI-driven approach that automates footprint generation,
using the IPC-7351 standards as a foundation.
Topics:
- Efficient Footprint Creation: Automating workflows to save time and reduce errors
- AI Integration: How algorithms analyse component dimensions to generate precise ECAD footprints
- Industry Impact: Case studies and live demonstrations showcasing real-world applications
“Integration of Advanced Wireless Technologies in Compact Consumer Devices With Accurate Positioning Capabilities”
on 30 January 2025 as part of the
Silicon-to-Systems and Design Techniques: Advanced Packaging session
Dr. Malek Chaabane, Brance Manager, habemus! electronic + transfer GmbH, Germany
Discover how advanced wireless technologies and wireless charging are being seamlessly integrated into consumer devices to achieve precise real-time localisation, compact designs, extended autonomy, and top-notch performance.
Topics:
- Designing antennas for optimal radio frequency and positioning performance.
- Enhancing wireless ranges while maintaining cost-efficiency
- Implementing low-power strategies to maximise battery life
- Using advanced manufacturing techniques to ensure quality and reliability
“Software-Based Design Optimisation of an Embedded Power Module”
Janagan Papperi Devarajulu Deenadayalan, Hardware Development Engineer, AT&S Austria Technologie & Systemtechnik AG, Austria
will present his innovative paper
on 30 January 2025
Topics:
- miniaturisation
- embedded component packaging
- software-based design validaiton
- minimise costly prototype iterations
- silicon-to-systems design techniques
- simulaiton tools for high-power embedded modules
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