Long Term And Cryogenic Endurance Of FPC Interconnection Approaches
This technical Article is created by following Authors:
Alois Friedberger, Andreas Helwig Airbus CRT, Central R&T, Taufkirchen (Munich), Germany
Patrick Hornung Airbus Defence & Space, Ottobrunn (Munich), Germany
Acknowledgements:
We highly appreciate the support of Joao Marques from Fraunhofer IZM conducting several FPC joining processes .
Lopec 2024 Poster Session Functional Materials; Abstract Number: 100879
Motivation
Approaches
Results
- Wedge bonding failed (attributed to elastic nature of foil materials) --> not further tested
- > 650 fast thermo cycles from - 55°C to + 85°C with all samples:
- only 3 contact failures (all on one and the same ACF test coupon)
- 5000 hours climate ageing at 70°C, 85% rH:
- no failure of any contact
- Cryogenic temperature cycling for approx. 6 month including 5045 cycles from -170°C to +130°C:
- Except for three individual electrical contacts, all samples passed,
- Exception:
- PEI substrate all contacts failed - attributed to PEI brittleness at cryogenic temperatures
Figure 1
Eight parallel copper tracks connecting the contact pads at the left and right end of the FPC.
Two FPC have been connected.
Figure 2
FPC (right) connected to a rigid PCB (left) before (botton) after (top) ageing in climate chamber.
Figure 3
Example of electrical resistance over two connected FPC during temperature cycling.
Conclusions
- "Standard" interconnection technologies provide stable electrical / mechanical contacts also for harsh environmental conditions as required by the aerospace industry.
- Performance at cryogenic temperature, as an even more demanding application scenario, necessitates the appropriate selection of a suitable substrate material.
Lopec 2024 Poster Session Functional Materials; Abstract Number: 100879
See Further Lopec 2024 Poster Session - Functional Meterials
Durability investigation of 3D printed electronics towards aeronautic-inspired environmental loads
by AIRBUS CRT and J.A.M.E.S GmbH
Related Articles
AI Impact On Semiconductor Manufacturing & Electronics Component Design
Artificial Intelligence (AI) is reforming in various industries, and the semiconductor manufacturing sector is no exception. AI's integration into semiconductor manufacturing and the design processes ...
Induction Motor Design Concept
The design shows the concept of an additively manufactured induction motor. The vision behind this is to 3D-print functional electric motors. Electric motors are most commonly manufactured by winding ...
What Software To Use For 3D Printing
3D printing is an innovative technology that creates three-dimensional objects from digital models. It has revolutionized industries such as manufacturing and healthcare by layering materials based ...
Advancements In Microelectronics: DARPA's Pioneering Initiatives
The recent introduction of the Additive Manufacturing of Microelectronic SystEms (AMME) program by the Defense Advanced Research Projects Agency (DARPA) shows a significant advancement in Additively ...
Silver Nanowires
Silver nanowires are one-dimensional structures with a diameter typically less than 100 nm and a length in the micrometer range. They are widely studied in the field of nanotechnology due to their ...
Why 3D Printing Is The Future
Due to its cost-effective and expedited production of friendly tailored, it comes as no shock that 3D printing has emerged as the leading force in modern-day manufacturing practices.