Technology Insights AME Publications Academic Research Durability Investigations Of 3D Printed Electronics Towards Aeronautic-inspired Environmental Loads

Durability Investigations Of 3D Printed Electronics Towards Aeronautic-inspired Environmental Loads

Apr 17, 2024

Alois Friedberger - Community

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Durability Investigations Of 3D Printed Electronics Towards Aeronautic-inspired Environmental Loads

Together with AIRBUS Central Research and Technology J.A.M.E.S engineering established collaboration activities in field of 3D printed electronics with interest for aeronautic usecase.

AME printed PCB's with hybrid integrated SMD- and bare die components had to show durability under aeronautic inspired environmental load conditions.

This technical Article is created by following Authors:

Alois Friedberger, Andreas Helwig Airbus CRT, Central R&T, Taufkirchen (Munich), Germany

Rolf Baltes, Andreas Salomon J.A.M.E.S GmbH, Taufkirchen (Munich), Germany

Acknowledgements:

We highly appreciate the support of Joao Marques from Fraunhofer IZM in the assembly process.

Motivation

Additively Manufactured Electronics (ame) Enables Electronic Fabrication Through 3d Printing Techniques

Fully 3-Dimensional Electronics by Processing Conductive and Non-Conductive Material and Building up Complex Structures Layer by Layer

Enablingadditional Design Possibilities Lead to Higher Integration Density, Smoother Rf Transitions, Less Usage of Raw Material and Harmful Chemicals

Limited Information on Durability of Ame Structures Lead to Test Structures Created to Evaluate Ame Without Additional Protective Housings for Potential Harsh Aeronautic Applications

Approach

Test Samples Printed With Nano Dimensions Dragonfly

250 μm Thick Dielectric Base Layer

Silver Ink to Create 18 μm Thick Conductive Tracks and Idc (interdigital Capacitor) With 125 μm Lines in Spaces

250 μm Thick Dielectric Cover With Cutouts

Integration of 230 μm Thick Smd (surface Mounted Device) by Soldering With Bismuth at 180 Degree C and 250 μm Thick Silicon Bare Die Using Aca (anisotropic Conductive Adhesive)

Dispensing a Drop of Globetop for Device Protection