Compact Multilayer Bandpass Filter
Compact Multilayer Bandpass Filter Using Low-Temperature Additively Manufacturing Solution
This publication was written by Li M., et al. in 2021, and present an additively manufactured bandpass filter (BPF) using a second-order stub-loaded resonator with multimetal layer components, fabricated through a low-temperature additive manufacturing electronics (AME) solution.
Overview
This publication presented an additively manufactured bandpass filter (BPF) based on a second-order stub-loaded resonator consisting of multimetal layer components. The proposed BPF is fabricated by a low-temperature (140°) additively manufactured electronics (AME) solution that can fabricate conductive and dielectric materials simultaneously with multimetal-layer and flexible interlayer distance. By reducing the interlayer distance, constant inductance and capacitance can be realized in smaller sizes, which helps to achieve device minimization. Taking advantage of this inkjet printing technology, a second-order multimetal layer resonator is proposed. To understand the principle of the BPF, an equivalent circuit with odd- and even-mode analysis is demonstrated. For verification, the frequency response of the circuit's mathematical model is calculated to compare with the electromagnetic simulation results. Good agreement can be achieved among the calculated, simulated, and measured results. The proposed BPF is designed at 12.25 GHz with a bandwidth of 40.8% and a compact size of 2.7 mm ×1.425 mm ×0.585 mm or 0.186λg ×0.098λg×0.040λg, which is suitable for circuit-in-package applications in television programs, radar detection, and satellite communications.