FED - 3D-Multilayer Devices (3D-MLD)
Nov 27, 2024
3D-Multilayer Devices (3D-MLD)
At the 32. FED conference 2024 in Ulm
presentation by Prof. Dr.-Ing. Ludger Overmeyer,
Leibniz University Hannover
Institute of Transport and Automation Technology, ITA
Prof. Dr.-Ing. Ludger Overmeyer as presenter at FED Conferece (Copyright Pia Simon photography)
(Copyright Pia Simon photography)
Multilayer 3D-MID as the Key to High Integration Density
Prof. Dr.-Ing. Ludger Overmeyer highlights the potential of nano-particel based copper printing with laser sintering and answers the central question of
How 3D-multilayer devices can be additively created using sequential laser sintering?
and gives some insights of:
- Nano-particle based copper coating of 3D-components
- Flexible substrate choice for various 3D-MID
- Sequential laser-processing to structure MID
- Low invest equipment for implementing this technology
- Environmental aspects
- VIA-generation on 3D-surfaces
- Solderability, temperature resilience and application scenarious
- Outlook for industrialization
And more…
For more information directly contact us at ITA Uni-Hannover
Related Articles
Community
2 Likes
2 Likes
J.A.M.E.S. At The 32nd FED Conference - Showcasing Innovation In 3D-Printed Electronics
26.09.2024
Fachverband Elektronikdesign und -fertigung e. V.
2 Likes
2 Likes
FED White Paper Edition 2024 - PART 3 - AME Class 3 And Class 4
06.09.2024
Fachverband Elektronikdesign und -fertigung e. V.
2 Likes
2 Likes
FED - 3D Printed Digital Solder Mask
27.11.2024
Technical University of Liberec
4 Likes
4 Likes
A Novel Approach To The Production Of Printed Patch Antennas
09.07.2024
Featured Partners
About Us
© 2025 J.A.M.E.S GmbH.