Technology Insights AME Designs J.A.M.E.S Coin NFC On AME 2D To 3D

J.A.M.E.S Coin NFC On AME 2D To 3D

Sep 6, 2023

Printed Circuit Structures (PCS) | Sensors and Antennas | Flight Control | DragonFly IV | Inkjet

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Design

A first design is finished, a complete explanation of the targeted functionality is included, and the targeted printer technology has been provided. This AME design also provides a model which is proven to fulfill the targeted functionality.

The goal of this design is purely educational. It is intended to provide hands-on approach on how to combine elements of traditional eCAD design tools with three-dimensional mCAD tools. The benefit of this approach is that for most electronic components, the manufacturers provide an elaborated set of data, like connections and footprints. To get access to this data, traditional eCAD tools are required to be used, however, these tools do not allow to design three-dimensional structures. To overcome this, the JAMES Coin NFC on AME – 2D to 3D design is used to introduce a way on how to combine the benefits of both approaches. Similar to the J.A.M.E.S Coin NFC on AME – Freestyle design, this current design is also based on the JAMES Coin Housing published by the J.A.M.E.S Team.

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Future Field of Application

Like the J.A.M.E.S Coin NFC on AME – Freestyle design, also the J.A.M.E.S Coin NFC on AME – 2D to 3D is very well suited as a basic test design, which can be used to evaluate new printer technologies.

Current Technology Limitations

It would be highly desirable to have a verified and validated procedure which allows the embedding of external COTS components, in order to yield higher stability of the soldering or gluing interconnections. Otherwise, the soldered or glued components can get lost quite fast by applying minimal mechanical stress.

Design Experiences

A first way of combining eCAD and mCAD design approaches is used in this educational design, however the method is still very hands-on. To further facilitate the design process, it would be desirable to have a real integration of an electronic schematic into a three-dimension mCAD tool.