Explore The Impact Of AME On The Bare Die Packaging Industry Webinar Recap
We extend our heartfelt gratitude to all attendees who joined us for an insightful webinar led by our esteemed expert, Nikita Rybalka. For those who couldn't attend or wish to revisit the valuable insights, the webinar recording is available.
Recap of the Webinar
Nikita kicked off the webinar by explaining the concept of bare die on its fundamental functionalities and addressing the essential question of why we should use it. The key takeaways included the remarkable benefits of miniaturization, cost-efficiency, and customization, enabling electronics to become smaller, more affordable, and tailored to specific needs.
Moreover, he explained the historical context, tracing the evolution of bare die packaging since its inception in the 1960s. Attendees gained an understanding of how this technology emerged and evolved over the decades, setting the stage for its pivotal role in modern electronics.
The webinar also covered the challenges faced in semiconductor packaging the complexities of miniaturization, and the intricacies of materials. For those who missed this enlightening webinar or wish to revisit Nikita's insights, we invite you to watch the recording at your convenience.
Webinar Recording
Explore the Impact of Ame on the Bare Die Packaging Industry