FED Working Group For 3D Electronics - New English White Paper Edition 2024

The FED Working Group for 3D Electronics presents its new 2024 AME Classification White Paper: "Classification of Additive Manufacturing and 3D Printing Processes for Electronics" (English Edition)

Hanno Platz, Head of the FED Working Group, Introduction

The growing demands for miniaturization and increased performance of electronic devices today go far beyond system integration, which is described as "More than Moore" and driving forces regarding Additive Manufacturing in the electrical and electronics industry.

AM is becoming increasingly important, especially for 3D electronics concepts. New 3D printing processes enable heterogeneous and functional integration through multi-hybrid and tool-free production. Both, physical and/or electrical functions, can be printed, additionally, electronic components can be assembled within a single operation.

With the new 3D printing processes, multidimensional substrates (components) and circuit carriers with integrated functions such as sensors, actuators, and electro-optical or bionic properties can be realized, without the need for a carrier substrate or already manufactured Printed Circuit Board.

Read the whole introduction by downloading the complete 2024 white paper

Acknowledgments to the white paper Co-authors:

• Michael Matthes, Würth Elektronik
• Markus Biener, Zollner Elektronik
• Daniel Ernst, Technische Universität Dresden
• Manuel Martin, KSG Leiterplatten
• Michael Schleicher, Semikron Danfoss
• Wolfgang Kühn, FED e.V.