AME Designs
View detailed AME application designs and learn about innovative 3D printed electronics. This section highlights advanced design practices and provides insights into the creative processes behind successful AME projects.
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J.A.M.E.S GmbH
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FUJI
Fraunhofer IKTS
Technology
Inkjet
General AME
Pick and Place (P&P)
Metallization
Printer
DragonFly IV
FPM-Trinity
Standard
IPC
Application Type
Printed Circuit Structures (PCS)
Sensors and Antennas
Embedded Electronics
Printed Circuit Board (PCB)
Airborne equipment
RF
Heterogeneous Integration
TestCoupon
power electronics
packaging
Tool
Flight Control
Qualification and Test
Dielectric Constant
Dissipation Factor
Warpage
Bond pulling test
Routing strategy
Full 3D wiring
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