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J.A.M.E.S. At The 32nd FED Conference - Showcasing Innovation In 3D-Printed Electronics

Sep 26, 2024

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J.A.M.E.S. At The 32nd FED Conference - Showcasing Innovation In 3D-Printed Electronics

Organized by FED, the Association of Electronic Design and Manufacturing, the 32nd FED Conference, on September 18-19, 2024, in Ulm, came under the motto "The Power of Collaboration - Design According to Production, Intelligent Manufacturing, Forward-Looking Management." The event attracted 320 participants. More than 46 specialized lectures, discussion panels, and practical workshops gave insight into the latest trends in printed circuit board design, connection technology, 3D electronics, manufacturing processes, and management strategies.

The highlights of the event were focused on subjects such as AI applications in production, additive manufacturing processes, sustainability, and novelties in high-speed design. This conference supplied an indispensable platform for sharing knowledge and exploring with industry professionals what could be expected in the future for this market.

Copyright Pia Simon photography

J.A.M.E.S Participation in 32nd FED Conference

The participation of J.A.M.E.S. in this event was truly an honor. In that regard, our Head of Engineering Dr. Rolf Baltes gave a presentation on the state-of-the-art developments in additively manufactured electronics (AME), also referred to as 3D-printed electronics.

His presentation focused on the transformative potential of new materials, innovative processes, and newly emerging applications of AME by focusing on the use of this technology in the realization of complex, three-dimensional conductive structures impossible to realize by conventional processing. He also discussed the status of additive manufacturing; he showed how the introduction of new materials and processes opens completely new opportunities in the design and manufacturing of electronic components.

During this conference, J.A.M.E.S showcased our latest AME applications, complemented by a number of them from our partners. Our team was able to meet and discuss with other professionals, sharing our views regarding the future of AM and how this will push the edges of innovation even further.

The 32nd FED Conference was a fantastic opportunity for collaboration, learning, and networking. We’re excited to continue the conversation with our community as we work together to advance the field of 3D printed electronics.