Populating DragonFly IV AMEs
Find out how to populate external COTS components on your AME design
Overview
To unleash the full potential of the futuristic AME technology, it is essential to be able to populate the printed structures with external COTS components. Here you will find detailed and verified information on how to achieve this goal. Currently two different assembly processes are available, namely a soldering process with an infrared heater as well as a gluing procedure using H20E conductive glue. To make the information more accessible, for each procedure a datasheet with the required data and a HowTo document giving a step-by-step guidance is ready for download on this page.
Manual Soldering With Low Temperature Solder Paste
A good way to assemble AME boards is to use IR-heater or vapor phase soldering with a low temperature profile.
IR-Heater Equipment
A cheap and easy way to get your AME device populated is to choose an IR-heater.
at J.A.M.E.S we are using an Infrared IC-Heater Model T962 for soldering our applications in one heating profile process.Â
Manual Use of Conductive Glue
For example by using H20E conductive glue and a drying oven.
Automatic Pick & Place
The professional way to populate components on an AME device by pick & place equipmentÂ
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