Breaking Update: J.A.M.E.S And XTPL Redefining 3D Manufacturing
J.A.M.E.S and XTPL's partnership has reached a milestone with prototype production to assess RF and electrical capabilities.
Project Progress: Taking the Next Leap
These prototypes act as evidence of concept for incorporating 3D printing electronics technology into System in Package(SIP) research and development manufacturing processes.
This specific example represents a significant step forward in collaboration with XTPL, as it integrates advanced technologies to establish an innovative manufacturing method. The bare die employed in this instance serves as a passive attenuator.
The DF-IV prints, shown in the images, is poised to be sent to XTPL for shipment. Upon arrival, it will enable the creation of a precise link between the bare die and substrate. This crucial stage underscores both companies' dedication to achieving unrivaled accuracy and setting the stage for future progress in this domain.
We will keep you informed about the latest developments as J.A.M.E.S and XTPL drive innovation in 3D manufacturing, pushing industry boundaries with each new breakthrough.
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