Exploring Multi-Material Printing For Rapid Prototyping Of Multilayer Hybrid Ceramic Components
This technical article is created by following authors:
Prashantkumar Pandey and Steffen Ziesche, Fraunhofer Institute for Ceramic Technologies and Systems IKTS
Lopec 2024 Poster Session
Key Points
Material Preparation
- Milling
- Particle size < 1µm
- Particle size distribution
- Characterization
Ink Formulation
- Properties:
- Viscosity 8-12 cP
- Surface tension 36-42 mN/m
- Density ~ 1 g/cm\( \)³
- AI2O3 ink, LTCC ink, TiO2 Ink
Preparation and Multi-Material 3D-Printing
- Process:
- Filtering the ink
- Waveform optimization
- Advanced software to import/edit/simulate the printing layout
- Automated real-time drop jetting analysis software
- Post-printing characterization software
Multi-Material Printing Process Approach
- Process:
- Fully digital and maskless technology
- Suitable with a wide range of inks and pastes
- Layer-by-layer deposition and cured between layers
- Integrated drying / curing process (UV, AdphasNIR, Novacentric Pulseforge)
- Working area of 305 x 305 mm²
Printing and Sintering Technology
Integrated Drying & Curing modules (by Ceradrop)
Functional Multi-Material 3D-Printing and Sintering/curing in One Device
Dr.-Ing. Steffen Ziesche of Fraunhofer IKTS presents advancements in ceramic multilayer manufacturing to new heights in this insightful presentation.
Applications
- Designed for Advanced Digital Process Development in multidisciplinary fields such as LTCC multilayer ceramic components and printed electronic applications like: RF IDs, interconnection of chips, photodetectors, lenses, semiconductor printing, sensors, piezoelectric actuators and fuel cells
- Development of high-resolution structures suitable for applications in printed electronics, including both low and high-frequency devices
- Offering a range of services in collaboration with industry and scientific partners in 3D printed electronics
Highlights
- Up to four different printing heads for applying a wide range of functional inks
- Functional printing on low- and high-temperature substrates in flat and 3D geometries
- Fully integrated and synchronized post-treatment modules (UV, Adphos NIR, Novacentrix Pulseforge) for drying and curing printed layers
- Additive manufacturing technology with high-resolution structures for applications in electronics (low and high frequency), microsystem technology and sensor technology
LOPEC 2024 Poster Session Fraunhofer IKTS
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