Publications
Exploring Multi-Material Printing For Rapid Prototyping Of Multilayer Hybrid Ceramic Components
This technical article is created by following authors: Prashantkumar Pandey and Steffen Ziesche, Fraunhofer Institute for Ceramic Technologies and Systems IKTS Lopec 2024 Poster Session
Revolutionizing Display Manufacturing: The Impact Of XTPL’s Ultra-precise Dispensing Technology
Advancements in high-tech display technology are revolutionizing the market with Ultra-HD and 8K screens now available, pushing the boundaries of picture quality. The demand for precise manufacturing ...
Long Term And Cryogenic Endurance Of FPC Interconnection Approaches
This technical Article is created by following Authors: Alois Friedberger, Andreas Helwig Airbus CRT, Central R&T, Taufkirchen (Munich), Germany Patrick Hornung ...
Durability Investigations Of 3D Printed Electronics Towards Aeronautic-inspired Environmental Loads
Together with AIRBUS Central Research and Technology J.A.M.E.S engineering established collaboration activities in field of 3D printed electronics with interest for aeronautic usecase. AME printed ...
The Mastery Of UPD Technology In Nanomaterial Dispensing For Advanced Manufacturing
XTPL Ultra Precise Dispensing (UPD) technology is a system, standing for precision and innovation, that seamlessly integrates into both existing and prospective production lines. The UPD system, ...
Understanding Flexible Hybrid Electronics: An In‑depth Exploration
Flexible Hybrid Electronics: an introduction 〰️➰ ➿ Traditional electronic devices are limited in their application due to their inflexibility and weight. In contrast, Flexible Hybrid ...
Design And Fabrication Of A Plastic-Free Antenna On A Sustainable Chitosan Substrate
"Design and Fabrication of a Plastic-Free Antenna on a Sustainable Chitosan Substrate" by I. Marasco et al., 2023.
Exploring The Production Process Behind Semiconductor Fabrication
🔬 Curious about the production process behind semiconductor fabrication? 🌟 Check out our insightful article, where we delve into the intricacies of manufacturing semiconductors and highlight ...
Flexible Quantum-Dot Light-Emitting Diodes Using Embedded Silver Mesh Transparent Electrodes Manufactured By An Ultraprecise Deposition Method
Flexible substrates with transparent conductive electrodes (TCEs) are essential components of organic-light-emitting diodes (OLEDs). However, Indium tin oxide (ITO), the prevailing transparent and ...
Printed Electronics For Highest Frequencies: 6G Wireless Communication Technology And Millimeter Wave Radar
by Dr. Uwe Partsch, Fraunhofer IKTS (Fraunhofer Institute for Ceramic Technologies and Systems IKTS) Ceramic substrate materials and adapted thick-film pastes and inks can make a significant ...
XTPL's Innovative High-Resolution Dispensing Technology For Advanced Electronics Manufacturing
XTPL team presents a comprehensive article concerning its own, disruptive technological solutions for extremely high-resolution dispensing of functional materials for manufacturing the next ...
Cube Satellites: Paving The Way For The Future Of Space Activities
Exploring the vast expanses of space has always captivated human imagination, driving us to uncover its mysteries and push technological boundaries. In recent times, Cube Satellites have emerged as ...
A Research Study: Advantages Of XTPL Delta Printing System
Authors of the article "All-Printed ZnO Nanowire based High-Performance Flexible Ultraviolet Photodetectors" prominently features the extensive use of the Delta Printing System in its research ...
TactoTek And Essemtec: Printed Electronics (Case Study)
Printed electronics have gained significant acceptance in the electronics industry due to its versatile functionalities in various manufacturing processes.
Signal Transmission Behavior Of Conductive Filaments In The Context Of Fused Filament Fabrication (FFF) Procedure
Explore David Neuhart's Bachelor Thesis on signal transmission in fused filament fabrication, comparing conductive filaments and variations in signal behavior.
Functional Multi-Material 3D Printing And Sintering/Curing In One Device
Dr.-Ing. Steffen Ziesche of Fraunhofer IKTS presents advancements in ceramic multilayer manufacturing to new heights in this insightful presentation.
Functionalization Of Additively Manufactured Ceramic Components Via Thick-film Technologies
by Lars Rebenklau, Fraunhofer IKTS (Fraunhofer Institute for Ceramic Technologies and Systems IKTS) The whitepaper provides a simplified overview of the basics of thick-film technology and its ...
Explaining The CerAM Vat Photo Polymerization Based On JAMES Coin Design
Article by Eric Schwarzer-Fischer, Nadine Lorenz and Uwe Scheithauer, Fraunhofer IKTS (Fraunhofer Institute for Ceramic Technologies and Systems IKTS)
Introduction To CerAMfacturing At Fraunhofer IKTS
This article provides you a full insider perspective with expertise and competence behind 3D ceramic technology by Uwe Scheithauer and Lars Rebenklau, Fraunhofer IKTS (Fraunhofer Institute for ...
Design And Performance Of AM In-Circuit Board Planar Capacitors
Sokol D., et al. showcase AM-based planar capacitors with diverse geometries, layers, and exceptional performance across multiple frequencies.
Design Parameters For The Additive Production Of Electronics
The research paper was prepared by Tim Frank, with support provided by J.A.M.E.S. Tim Frank took the lead in preparing the paper, showcasing his expertise and dedication.
Compact Multilayer Bandpass Filter
Compact Multilayer Bandpass Filter Using Low-Temperature Additively Manufacturing Solution This publication was written by Li M., et al. in 2021, and present an additively manufactured bandpass ...
Additively Manufactured Millimeter-Wave
Additively Manufactured Millimeter-Wave Dual-Band Single-Polarization Shared Aperture Fresnel Zone Plate Metalens Antenna This publication was written by Zhu, J., et al. in 2021 and presents the ...
Introduction To AME And What It Can Do For You
The research paper was prepared by the J.A.M.E.S. engineering team and primarily focuses on the advantages of Additively Manufactured Electronics (AME) over traditional printed circuit board (PCB) ...
Investigation Of Material Models For Fiber Reinforced Plastics
This master thesis was prepared by Michael Grüfelder, with support from J.A.M.E.S. Michael took the lead in its preparation, showcasing expertise and dedication to the research process.