Innovative Packaging With AME Technology Webinar
Our gratitude goes out to all the attendees who made our August 24th webinar, 'Innovative Packaging with AME Technology,' a resounding success. Your participation added value to the session as we explored the groundbreaking field of AME design and System Packaging.
Recap of the Webinar
During the webinar, 'Innovative Packaging with AME Technology,' Dr. Rafael navigated a spectrum of vital themes. Starting with an insightful Introduction, it addressed challenges like performance enhancement and supply chain complexities. The comparison between Traditional Manufacturing and Sustainable AM Solutions underscored AME's potential to revolutionize sustainability.
Furthermore, he unveiled AME Packaging's evolution, the intricacies of System in Package (SiP) Development Flow, and the groundbreaking concept of Reconfigurable Front-end SiP (RFSiP). Lastly, it delved into Power Transistor AME Packaging, exemplifying AME's prowess in power transistor enhancement. Through dynamic discussions, the webinar illuminated the transformative nature of AME and its vital role in electronics packaging.
For those who were unable to attend the live session, we are pleased to inform you that the recording is now available for viewing. Simply log in or register on our website to catch up on the insightful session.
We are committed to hosting more webinars in the future, providing opportunities for professionals and enthusiasts to expand their knowledge in the field of AME. Stay tuned for updates on our upcoming webinars on our event page, and be sure to reserve your spot to stay at the forefront of AME innovation.
Once again, thanks to all the participants for making the webinar a success. We value your support and look forward to welcoming you to future events.