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The Art Of 3D Ceramics And AMEfication Perspectives

May 16, 2024

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The Art Of 3D Ceramics And AMEfication Perspectives

Fabricating 3D form factors with extremely robust materials and achieving 3D electrification for RF use cases seem to be one of the most promising applications for AME.

Material-Ceramic

the ultimative choice for harsh operational conditions
- for mechanical robustness
- to withstand highest temperatures
- to withstand harmful substances
- for biocompatibiliy and recycling issues

the enabler for high frequency applications
- lowest dielectric loss factors
- high dielectric constant

3D Ceramics for Industrial Applications

picture by Lithoz

Lithoz technical data for material lithalox

DIAMOND HARD - 3D-Printed Silicon Carbide

picture by Lithoz in cooperation with Fraunhofer IKTS

Lithoz aerospace applications

3D Ceramic Manufacturing Process

reach out full 3D formfactors in high surface quality

3D Ceramics Functionalization

Functionalization of additively manufactured ceramic components by FhG IKTS

Article Functionalization Of Additively Manufactured Ceramic Components Via Thick-film Technologies

3D Ceramics Functionalization

Realization of the J.A.M.E.S Coin by FhG IKTS

Article J.A.M.E.S Coin NFC On AME In 3D Ceramics

3D Ceramic AMEfication

Combine 3D Smart System design strength with best material properties (mechanical and electrical) for electrified high performance applications
come closer to HOT & HARSH operation

3D Ceramics - Plasma Igniter

FhG IKTS in cooperation with AMAREA Technology GmbH

Article AME Ignition Device

3D Ceramics - Electronic Packaging

Sensor Triad application by FhG IKTS and FhG ENAS

Article Printed Electronics For Highest Frequencies

3D Ceramic for Special Electro/optical Applications

Indeed - this material gives an additional vision - transparent 3D Ceramics

Comments

Andreas Salomon 2mos ago

It is incredible, what's possible in 3D-printing ceramics now!To see 3D printed structures of SiC deeply impresses me - from perspective of high power semiconductors, LED's or ultra broadband RF power amplifiers SiC or GaN on SIC is playing a major role.Imagine new 3D-printed SiC housing concepts for optimal thermal adaptation to the hotspot semiconductor areas...Exciting Vision... isn't it ?