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Functionalization Of Additively Manufactured Ceramic Components Via Thick-film Technologies
Functionalization Of Additively Manufactured Ceramic Components Via Thick-film Technologies
Oct 18, 2023
by Lars Rebenklau,  Fraunhofer IKTS (Fraunhofer Institute for Ceramic Technologies and Systems IKTS)
The whitepaper provides a simplified overview of the basics of thick-film technology and its adaptation to additively manufactured ceramic components based on aluminum oxide (Al2O3). This technology can be used to print and fuse electrical conductors, resistors, heating elements or sensors onto the ceramic substrates. The electrical connection contact is realized by proven methods of the packaging technology of electronics. The advantage of this approach is that the materials required for functionalization are available on an industrial scale.
Download whitepaper provided by Fraunhofer IKTS
Introduction To CerAMfacturing At Fraunhofer IKTS
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