This AME design has the status of concept. A first design concept is established, a complete explanation of the targeted functionality is included, and the targeted printer technology has been provided.
FPM-Trinity, an innovative AME system by FUJI, a leading pick & place manufacturer, combines AME and SMT to automate electronic board creation.
A core layer can be formed on the build plate by resin ink printing and UV exposure. FPM-Trinity has silver ink printing and sintering processes to create electrical circuit layers. By using resin formation and silver circuit formation, FPM-Trinity can also make multi-layer circuits with layer to layer electrical connections. For the parts mounting process, FPM-Trinity doesn’t use common solder paste. To achieve extremely low temperature parts mounting, we apply silver conductive paste and epoxy paste.
Low temperature SMT
In order to mount on 3D printed boards, it is important to maintain a low temperature. The resin used in 3D printers has a higher CTE and lower Tg compared to general PCB, so it is difficult to adapt to solder reflow processes like those for generic PCBs. Therefore, FPM-Trinity uses Ag conductive paste to achieve ultra low temperature SMT.
Unlike common solder reflow processes, the peak temperature is less than 100 deg. C