FED White Paper Edition 2024 - AME Classification Overview
With reference to the newly released 2024 AME Classification White Paper, titled "Classification of Additive Manufacturing and 3D-Printing Processes for Electronics," the FED Working Group for 3D Electronics introduces five distinct classes/types of processes for 3D-printed electronics.
Get in Touch With the Different Types of 3D Electronics
Stay tuned for upcoming articles that will provide a step-by-step explanation of how 3D-printed electronics can be designed and processed.
Part 1: Introduction to 3D Electronics
The white paper discusses the role of Additive Manufacturing in the production of electronics, from the opportunities to the challenges that have presented themselves. It has introduced a system for the classification of AM processes to support future improvements in the manufacturing of electronics and has focused on how to optimize materials for the processes involved, such as inkjet printing.
Part 2: AME Classification (Class 1 & 2)
- AME Class 1
- Existing support - planar rigid or flexible
- Additively applied functional layers (e.g. solder stop mask, solder pastes, surfaces, insulation)
- AME Class 2
- Existing 3D support - rigid or flexible
- Additively applied functional layers (e.g. solder, stop mask, solder pastes, surfaces, insulation)
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Part 3: AME Classification (Class 3 & 4)
- AME Class 3
- Carrier printed (2.5D & 3D)
- Additively manufactured functional layers, additively applied functional layers
- AME Class 4
- Carrier printed (2.5D & 3D)
- Additively manufactured functional layers, layers embedded components (SMD etc.)
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Part 4: AME Classification (Class 5 (4D))
AME Class 5 (4D)
- AME Class 5
- 4D - designed & printed in 3D includingÂ
- 3D design conductive and non-conductive layers embedded components, mechanical
and further topics
- Overview of manufacturing technologies
- Digital printing and environmental goals
- Growth of Additive Manufacturing (AM)
Part 5: Design Tools for 3D Electroncis
Design Tools for 3D electronics
- Requirements for the data formats
- production and scalability
- prom the perspective to scalability
will be published soon
View the Full English Whitepaper
Download the full English whitepaper by the FED Working Group for 3D Electronics.
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