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The purpose of this educational design is to show how to replace external COTS capacitors with AME capacitors that can be embedded into the final AME structures. To highlight the procedure with a specific example, the J.A.M.E.S Coin NFC on AME – Freestyle design, published by the J.A.M.E.S Team, is used as a basis while replacing the capacitors populated on the structures by AME capacitors.
Future field of application:
Especially for the design of AME capacitors, it would be highly interesting to realize the J.A.M.E.S Coin NFC on AME – PrintC structure within a ceramic process.
Current technology limitations:
The NNDM DragonFly IV process is quite limited in the design of AME capacitors due to the availability of only one dielectric polymer material. So, by providing additional inks with a higher permittivity, the required space for AME capacitors would drastically decrease.
Key Features
Introducing first concepts of design possibilities of mCAD tools
Transforming a CAD model to a printed AME structure
FundAMEntals
(8)
FundAMEntal_DragonFlyIV_Nano_Dimension
1.77 MB
FundAMEntal_Conductive_Gluing_Datasheet
12.88 MB
FundAMEntal_Conductive_Gluing_HowTo
25.47 MB
FundAMEntal_IR_Heater_Soldering_HowTo
13.52 MB
FundAMEntal_IR_Heater_Soldering_Datasheet
14.61 MB
Fundamentals_Container
0.79 MB
PCB_Design_Rules_for_DragonFly_IV
0.41 MB
FundAMEntal_Slicing3DBodies
4.89 MB
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